Circuit substrate and light emitting diode package

• US 8,879,023 B2
• Filed: 02/11/2009
• Issued: 11/04/2014
• Est. Priority Date: 05/15/2008
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Tsou, Wen-Chieh
• Primary Examiner(s): Nguyen, Hoan C
• Application Number:
  US12/369,729
• Publication Number:
  US 20090283790A1
• Time in Patent Office: 2,092 Days
• Field of Search: 349 61- 71, 257/99, 257/100, 257/81, 257/82, 257/88, 345/39, 345/46
• US Class Current: 349/61
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units.

Claims

1. A light emitting diode (LED) package, comprising:

a carrier, comprising;

a substrate, having a top surface, a bottom surface opposite to the top surface and two through grooves connecting the top surface and the bottom surface;

a first electrode, having a top edge parallel to the top surface of the substrate and a side edge connected to the top edge, the first electrode disposed on the substrate and covering one of the through grooves;

a first lead, disposed on the substrate and connected to the side edge of the first electrode;

a second electrode, having a top edge parallel to the top surface of the substrate and a side edge connected to the top edge, the second electrode disposed on the substrate and covering on top of the other one of the through grooves;

a second lead, disposed on the substrate and connected to the side edge of the second electrode; and

a LED chip, disposed on the first lead and electrically connected to the first lead and the second lead; and

an encapsulant, disposed on the substrate and covering the first lead, the second lead, and the LED chip, wherein each of the first electrode and the second electrode has two adjacent cutting edges located at a corner, the two cutting edges are not parallel to each other, the top surface of the substrate has a plurality of sides and the first electrode, the first lead, the second electrode, and the second lead are located at the same side of the top surface of the substrate, and the first electrode is located only at one of the corners of the substrate, and the second electrode is located only at another one of the corners of the substrate.

2. The LED package according to claim 1, wherein the first lead has a chip carrying portion and a wire bonding portion, and the LED chip is disposed on the chip carrying portion and is electrically connected to the wire bonding portion.

3. The LED package according to claim 2, wherein the first lead has at least one flush proof notch located between the chip carrying portion and the wire bonding portion.

4. The LED package according to claim 2, wherein the first lead has a flush proof opening located between the chip carrying portion and the wire bonding portion.