Semiconductor device and method for fabricating the same
First Claim
1. A method for fabricating a semiconductor device, the method comprising:
- forming a plurality of mask patterns comprising a real mask pattern and a dummy mask pattern on a semiconductor substrate of the semiconductor device;
removing the dummy mask pattern, wherein removing the dummy mask pattern forms a preliminary trench in the semiconductor substrate; and
thenetching the semiconductor substrate using the real mask pattern as a mask to form a first trench, a second trench having a depth greater than the first trench, and a fin-type pattern defined by the first trench and the second trench;
wherein the second trench contacts the fin-type pattern and comprises a smooth pattern which is convex and is positioned between a bottom surface and a side surface of the second trench, a first concave portion which is positioned between the side surface of the second trench and the smooth pattern, and a second concave portion which is positioned between the smooth pattern and the bottom surface of the second trench.
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Accused Products
Abstract
A method of fabricating a semiconductor device includes forming a plurality of mask patterns comprising a real mask pattern and a dummy mask pattern on a substrate, removing the dummy mask pattern and etching the substrate using the real mask pattern as a mask to form a first trench, a second trench, and a fin-type pattern defined by the first trench and the second trench. The second trench contacting the fin-type pattern comprises a smooth pattern which is convex and positioned between a bottom surface and a side surface of the second trench, a first concave portion which is positioned between the side surface of the second trench and the smooth pattern, and a second concave portion which is positioned between the convex portion and the bottom surface of the second trench.
19 Citations
24 Claims
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1. A method for fabricating a semiconductor device, the method comprising:
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forming a plurality of mask patterns comprising a real mask pattern and a dummy mask pattern on a semiconductor substrate of the semiconductor device; removing the dummy mask pattern, wherein removing the dummy mask pattern forms a preliminary trench in the semiconductor substrate; and
thenetching the semiconductor substrate using the real mask pattern as a mask to form a first trench, a second trench having a depth greater than the first trench, and a fin-type pattern defined by the first trench and the second trench; wherein the second trench contacts the fin-type pattern and comprises a smooth pattern which is convex and is positioned between a bottom surface and a side surface of the second trench, a first concave portion which is positioned between the side surface of the second trench and the smooth pattern, and a second concave portion which is positioned between the smooth pattern and the bottom surface of the second trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating a semiconductor device, the method comprising:
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forming a mask pattern having a predetermined pitch on a semiconductor substrate of the semiconductor device, wherein the mask pattern comprises a real mask pattern and a dummy mask pattern; removing the dummy mask pattern to form a pre-second trench in the semiconductor substrate and a sharp pattern in the semiconductor substrate and protruding therefrom between the pre-second trench and the real mask pattern; and
thenetching the semiconductor substrate using the real mask pattern as a mask to form a first trench, a second trench formed by increasing a depth of the pre-second trench, and a smooth pattern formed by increasing a smoothness of a surface of the sharp pattern, wherein the smooth pattern is convex and is positioned between a bottom and a side surface of the second trench. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method of fabricating a semiconductor device, the method comprising:
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forming mask patterns on a semiconductor substrate of the semiconductor device; performing an etch process comprising; selectively removing at least one of the mask patterns to define a preliminary trench in the semiconductor substrate adjacent remaining ones of the mask patterns without removing the semiconductor substrate therebetween, wherein edges of the preliminary trench define sharp patterns in the semiconductor substrate and protruding therefrom; and
thenetching the semiconductor substrate between the remaining ones of the mask patterns to define fin-type patterns protruding from the semiconductor substrate and a shallow trench therebetween, wherein the etching dulls the sharp patterns and increases a depth of the preliminary trench to define a deep trench in the semiconductor substrate adjacent one of the fin-type patterns; and responsive to performing the etch process, forming device isolating patterns in the shallow trench and in the deep trench. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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Specification